Datasheet

MSP430F23x0

SLAS518E –AUGUST 2006– REVISED AUGUST 2011

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Table 1. Available Options

PACKAGED DEVICES

(1)(2)

PLASTIC 49-PIN DSBGA PLASTIC 40-PIN QFN

(YFF) (RHA)

MSP430F2330IYFF MSP430F2330IRHA

-40°C to 85°C MSP430F2350IYFF MSP430F2350IRHA

MSP430F2370IYFF MSP430F2370IRHA

- MSP430F2330TRHA

-40°C to 105°C - MSP430F2350TRHA

- MSP430F2370TRHA

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

Development Tool Support

All MSP430 microcontrollers include an Embedded Emulation Module (EEM) that allows advanced debugging

and programming through easy-to-use development tools. Recommended hardware options include:

• Debugging and Programming Interface with Target Board

– MSP-FET430U23X0 (RHA package)

• Debugging and Programming Interface

– MSP-FET430UIF (USB)

– MSP-FET430PIF (Parallel Port)

• Target Board

– MSP-TS430QFN23X0 (RHA package)

• Production Programmer

– MSP-GANG430