Datasheet

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SLAS439A − SEPTEMBER 2004 − REVISED JUNE 2005
12
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings (see Note 1)
Voltage applied at V
CC
to V
SS
−0.3 V to 4.1 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Voltage applied to any pin (see Note 2) −0.3 V to V
CC
+0.3 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Diode current at any device terminal ±2 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
(unprogrammed device, see Note 3) −55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, T
stg
(programmed device, see Note 3) −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . .
NOTES: 1. Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended
operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
2. All voltages referenced to V
SS
. The JTAG fuse-blow voltage, V
FB
, is allowed to exceed the absolute maximum rating. The voltage
is applied to the TEST pin when blowing the JTAG fuse.
3. Higher temperature may be applied during board soldering process according to the current JEDEC J−STD−020 specification with
peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.
recommended operating conditions
MIN NOM MAX UNIT
Supply voltage during program execution, V
CC
1.8 3.6 V
Supply voltage during program/erase flash memory, V
CC
2.2 3.6 V
Supply voltage, V
SS
0 V
Operating free-air temperature range, T
A
−40 85 °C
V
CC
= 1.8 V, Duty Cycle = 50% ±10% 0 6
Processor frequency f
SYSTEM
(Maximum MCLK frequency)
(see Notes 1, 2 and Figure 1)
V
CC
= 2.7 V, Duty Cycle = 50% ±10%
(see Note 3)
0 12
MHz
(Maximum MCLK frequency)
(see Notes 1, 2 and Figure 1)
V
CC
= 3.3 V, Duty Cycle = 50% ±10%
(see Note 4)
0 16
MHz
NOTES: 1. The MSP430 CPU is clocked directly with MCLK.
Both the high and low phase of MCLK must not exceed the pulse width of the specified maximum frequency.
2. Modules might have a different maximum input clock specification. Refer to the specification of the respective module in this
datasheet.
3. This includes using the provided DCO calibration value for 12 MHz for V
CC
= 2.7 V to 3.6 V and T
A
= −40°C to 85°C.
4. This includes using the provided DCO calibration value for 16 MHz for V
CC
= 3.3 V to 3.6 V and T
A
= −40°C to 85°C.
6 MHz
12 MHz
16 MHz
1.8 V 2.2 V 2.7 V 3.3 V 3.6 V
Supply voltage range,
during flash memory
programming
Supply voltage range,
during program execution
Supply Voltage −V
System Frequency −MHz
NOTE: Minimum processor frequency is defined by system clock. Flash program or erase operations require a minimum V
CC
of 2.2 V.
Figure 1. Operating Area