Datasheet

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TEST
V
CC
P2.5/CA5
V
SS
XOUT/P2.7/CA7
XIN/P2.6/CA6
RST/NMI
P2.0/ACLK/CA2
P2.1/INCLK/CA3
P2.2/CAOUT/TA0/CA4
P1.7/TA2/TDO/TDI
P1.6/TA1/TDI/TCLK
P1.5/TA0/TMS
P1.4/SMCLK/TCK
P1.3/TA2
P1.2/TA1
P1.1/TA0
P1.0/TACLK
P2.4/TA2/CA1
P2.3/TA1/CA0
11
P2.4/TA2/CA1
10
P2.3/TA1/CA0
9
NC
8
P2.2/CAOUT/TA0/CA4
7
P2.1/INCLK/CA3
12
NC
5
RST/NMI
4
XIN/P2.6/CA6
3
XOUT/P2.7/CA7
2
V
SS
1
NC
6
P2.0/ACLK/CA2
14
P1.1/TA0
15
P1.2/TA1
16
P1.3/TA2
17
P1.4/SMCLK/TCK
18
P1.5/TA0/TMS
13
P1.0/TACLK
20
P1.6/TA1/TDI/TCLK
21
P1.7/TA2/TDO/TDI
22
TEST
23
V
CC
24
P2.5/CA5
19
NC
Exposed
Thermal Pad
MSP430F21x1
www.ti.com SLAS439F –SEPTEMBER 2004– REVISED AUGUST 2011
Device Pinout
DW, PW, or DGV PACKAGE
(TOP VIEW)
RGE PACKAGE
(TOP VIEW)
A. NC = Not internally connected
B. Exposed thermal pad connection to V
SS
recommended.
Copyright © 2004–2011, Texas Instruments Incorporated 3