Datasheet

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14
2
3
4 9
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12
6 7
15
RSA PACKAGE
(TOP VIEW)
DV
CC
DV
SS
AV
CC
AV
SS
P1.3/VREF/A1−
P1.2/TA1/A1+/A4−
P1.1/TA0/A0−/A4+
P1.0/TACLK/ACLK/A0+
TEST/SBWTCK
XOUT/P2.7
XIN/P2.6/TA1
RST
/NMI/SBWTDIO
P1.7/A3−/SDI/SDA/TDO/TDI
P1.6/TA1/A3+/SDO/SCL/TDI/TCLK
P1.4/SMCLK/A2+/TCK
P1.5/TA0/A2−/SCLK/TMS
MSP430F2013-EP
SLAS774A –JULY 2011– REVISED OCTOBER 2011 www.ti.com
Table 1. ORDERING INFORMATION
(1)
T
A
PACKAGE
(2)
ORDERABLE PART NUMBER VID NUMBER
-40°C to 125°C QFN (RSA) MSP430F2013QRSATEP V62/11613-01XE
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
Web site at www.ti.com.
(2) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
Device Pinout
See port schematics section for detailed I/O information.
2 Copyright © 2011, Texas Instruments Incorporated