Datasheet

MSP430F5219IRGC
MSP430F5217IRGC
1P6.0/CB0
2P6.1/CB1
3P6.2/CB2
4P6.3/CB3
5P6.4/CB4
6P6.5/CB5
7P6.6/CB6
8P6.7/CB7
9P5.0
10P5.1
11AVCC
12P5.4/XIN
13P5.5/XOUT
14AVSS
15DVCC
16DVSS
17
VCORE
18
P1.0/TA0CLK/ACLK
19
P1.1/TA0.0
20
P1.2/TA0.1
21
P1.3/TA0.2
22
P1.4/TA0.3
23
P1.5/TA0.4
24
P1.6/TA1CLK/CBOUT
25
P1.7/TA1.0
26
P2.0/TA1.1
27
P2.1/TA1.2
28
P2.2/TA2CLK/SMCLK
29
P2.3/TA2.0
30
P2.4/TA2.1
31
P2.5/TA2.2
32
P2.6/RTCCLK/DMAE0
33 P2.7/UCB0STE/UCA0CLK
34 P3.0/UCB0SIMO/UCB0SDA
35 P3.1/UCB0SOMI/UCB0SCL
36 P3.2/UCB0CLK/UCA0STE
37 P3.3/UCA0TXD/UCA0SIMO
38 P3.4/UCA0RXD/UCA0SOMI
39 DVSS
40 DVIO
41 P4.0/PM_UCB1STE/PM_UCA1CLK
42 P4.1/PM_UCB1SIMO/PM_UCB1SDA
43 P4.2/PM_UCB1SOMI/PM_UCB1SCL
44 P4.3/PM_UCB1CLK/PM_UCA1STE
45 P4.4/PM_UCA1TXD/PM_UCA1SIMO
46 P4.5/PM_UCA1RXD/PM_UCA1SOMI
47 P4.6/PM_NONE
48 P4.7/PM_NONE
49
P7.0/TB0.0
50
P7.1/TB0.1
51
P7.2/TB0.2
52
P7.3/TB0.3
53
P7.4/TB0.4
54
P7.5/TB0.5
55
BSLEN
56
RST/NMI
57
P5.2/XT2IN
58
P5.3/XT2OUT
59
TEST/SBWTCK
60
PJ.0/TDO
61
PJ.1/TDI/TCLK
62
PJ.2/TMS
63
PJ.3/TCK
64
RSTDVCC/SBWTDIO
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D –NOVEMBER 2012–REVISED OCTOBER 2013 www.ti.com
Pin Designation – F5219, F5217 – RGC Package
NOTE: Connection of exposed thermal pad to V
SS
is recommended.
8 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: MSP430F5229 MSP430F5227 MSP430F5224 MSP430F5222 MSP430F5219 MSP430F5217
MSP430F5214 MSP430F5212