Datasheet
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
www.ti.com
SLAS718D –NOVEMBER 2012–REVISED OCTOBER 2013
Crystal Oscillator, XT2
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
(1)(2)
PARAMETER TEST CONDITIONS V
CC
MIN TYP MAX UNIT
f
OSC
= 4 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 0, 200
T
A
= 25°C
f
OSC
= 12 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 1, 260
T
A
= 25°C
XT2 oscillator crystal current
I
DVCC.XT2
3.0 V µA
consumption
f
OSC
= 20 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 2, 325
T
A
= 25°C
f
OSC
= 32 MHz, XT2OFF = 0,
XT2BYPASS = 0, XT2DRIVEx = 3, 450
T
A
= 25°C
XT2 oscillator crystal frequency,
f
XT2,HF0
XT2DRIVEx = 0, XT2BYPASS = 0
(3)
4 8 MHz
mode 0
XT2 oscillator crystal frequency,
f
XT2,HF1
XT2DRIVEx = 1, XT2BYPASS = 0
(3)
8 16 MHz
mode 1
XT2 oscillator crystal frequency,
f
XT2,HF2
XT2DRIVEx = 2, XT2BYPASS = 0
(3)
16 24 MHz
mode 2
XT2 oscillator crystal frequency,
f
XT2,HF3
XT2DRIVEx = 3, XT2BYPASS = 0
(3)
24 32 MHz
mode 3
XT2 oscillator logic-level square-
XT2BYPASS = 1
(4)(3)
f
XT2,HF,SW
wave input frequency, bypass 0.7 32 MHz
XT2BYPASSLV = 0 or 1
mode
XT2DRIVEx = 0, XT2BYPASS = 0,
450
f
XT2,HF0
= 6 MHz, C
L,eff
= 15 pF
XT2DRIVEx = 1, XT2BYPASS = 0,
320
f
XT2,HF1
= 12 MHz, C
L,eff
= 15 pF
Oscillation allowance for
OA
HF
Ω
HF crystals
(5)
XT2DRIVEx = 2, XT2BYPASS = 0,
200
f
XT2,HF2
= 20 MHz, C
L,eff
= 15 pF
XT2DRIVEx = 3, XT2BYPASS = 0,
200
f
XT2,HF3
= 32 MHz, C
L,eff
= 15 pF
f
OSC
= 6 MHz,
XT2BYPASS = 0, XT2DRIVEx = 0, 0.5
T
A
= 25°C, C
L,eff
= 15 pF
t
START,HF
Startup time 3.0 V ms
f
OSC
= 20 MHz,
XT2BYPASS = 0, XT2DRIVEx = 2, 0.3
T
A
= 25°C, C
L,eff
= 15 pF
Integrated effective load
C
L,eff
1 pF
capacitance, HF mode
(6) (1)
Duty cycle Measured at ACLK, f
XT2,HF2
= 20 MHz 40 50 60 %
(1) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(2) To improve EMI on the XT2 oscillator the following guidelines should be observed.
(a) Keep the traces between the device and the crystal as short as possible.
(b) Design a good ground plane around the oscillator pins.
(c) Prevent crosstalk from other clock or data lines into oscillator pins XT2IN and XT2OUT.
(d) Avoid running PCB traces underneath or adjacent to the XT2IN and XT2OUT pins.
(e) Use assembly materials and techniques that avoid any parasitic load on the oscillator XT2IN and XT2OUT pins.
(f) If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(3) This represents the maximum frequency that can be input to the device externally. Maximum frequency achievable on the device
operation is based on the frequencies present on ACLK, MCLK, and SMCLK cannot be exceed for a given range of operation.
(4) When XT2BYPASS is set, the XT2 circuit is automatically powered down. Input signal is a digital square wave with parametrics defined
in the Schmitt-trigger Inputs section of this data sheet. When in crystal bypass mode, XT2IN can be configured so that it can support an
input digital waveform with swing levels from DVSS to DVCC (XT2BYPASSLV = 0) or DVSS to DVIO (XT2BYPASSLV = 1). In this case,
it is required that the pin be configured properly for the intended input swing.
(5) Oscillation allowance is based on a safety factor of 5 for recommended crystals.
(6) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, it is recommended to verify the correct load by measuring the ACLK frequency. For a
correct setup, the effective load capacitance should always match the specification of the used crystal.
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