Datasheet

1P6.3/CB3
2P6.4/CB4
3P6.5/CB5
4P5.0
5P5.1
6AVCC
7P5.4/XIN
8P5.5/XOUT
9AVSS
10DVCC
11DVSS
12VCORE
13
P1.0/TA0CLK/ACLK
14
P1.1/TA0.0
15
P1.2/TA0.1
16
P1.3/TA0.2
17
P1.4/TA0.3
18
P1.5/TA0.4
19
P1.6/TA1CLK/CBOUT
20
P1.7/TA1.0
21
P2.7/UCB0STE/UCA0CLK
22
P3.0/UCB0SIMO/UCB0SDA
23
P3.1/UCB0SOMI/UCB0SCL
24
P3.2/UCB0CLK/UCA0STE
25 P3.3/UCA0TXD/UCA0SIMO
26 P3.4/UCA0RXD/UCA0SOMI
27
P4.0/PM_UCB1STE/PM_UCA1CLK
28
P4.1/PM_UCB1SIMO/PM_UCB1SDA
29
P4.2/PM_UCB1SOMI/PM_UCB1SCL
30
P4.3/PM_UCB1CLK/PM_UCA1STE
31
DVSS
32
DVIO
33 P4.4/PM_UCA1TXD/PM_UCA1SIMO
34 P4.5/PM_UCA1RXD/PM_UCA1SOMI
35 P4.6/PM_NONE
36 BSLEN
37
RST/NMI
38
P5.2/XT2IN
39
P5.3/XT2OUT
40
TEST/SBWTCK
41
PJ.0/TDO
42
PJ.1/TDI/TCLK
43
PJ.2/TMS
44
PJ.3/TCK
45
RSTDVCC/SBWTDIO
46
P6.0/CB0
47
P6.1/CB1
48
P6.2/CB2
MSP430F5214IRGZ
MSP430F5212IRGZ
MSP430F5229, MSP430F5227, MSP430F5224, MSP430F5222
MSP430F5219, MSP430F5217, MSP430F5214, MSP430F5212
SLAS718D –NOVEMBER 2012–REVISED OCTOBER 2013 www.ti.com
Pin Designation – F5214, F5212 – RGZ Package
NOTE: Connection of exposed thermal pad to V
SS
is recommended.
10 Submit Documentation Feedback Copyright © 2012–2013, Texas Instruments Incorporated
Product Folder Links: MSP430F5229 MSP430F5227 MSP430F5224 MSP430F5222 MSP430F5219 MSP430F5217
MSP430F5214 MSP430F5212