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MSP-TS430RGC64B

www.ti.com

Table B-20. MSP-TS430RGC64B Bill of Materials

No. per

Pos. Ref Des Description DigiKey Part No. Comment

Board

1 C1, C2 0 12pF, SMD0805 DNP

2 C3, C4 0 47pF, SMD0805 DNP

3 C6, C7, C10 3 10uF, 6.3V, SMD0805

C5, C11,

4 C13, C14, 5 100nF, SMD0805 311-1245-2-ND

C15

5 C8 1 2.2nF, SMD0805

6 C9 1 470nF, SMD0805 478-1403-2-ND

7 C16 1 4.7uF, SMD0805

8 C17 1 220nF, SMD0805

9 D1 1 green LED, SMD0805 P516TR-ND

SAM1029-16-ND DNP: Headers and receptacles

J1, J2, J3,

10 0 16-pin header, TH (Header) SAM1213-16- enclosed with kit. Keep vias free of

ND (Receptacle) solder:

11 J5 , J6 2 3-pin header, male, TH

JP3, JP5,

place jumpers on pins 2-3 on JP5, JP6,

JP6, JP7,

12 7 3-pin header, male, TH SAM1035-03-ND JP7, JP8, JP9, JP10 place jumpers on

JP8, JP9,

pins 1-2 on JP3,

JP10

JP1, JP2,

13 3 2-pin header, male, TH SAM1035-02-ND Place jumper on header

JP4

14 10 Jumper 15-38-1024-ND See Pos. 12 and Pos. 13

14-pin connector, male,

15 JTAG 1 HRP14H-ND

10-pin connector, male,

16 BOOTST 0 "DNP Keep vias free of solder"

Micro Crystal MS3V-T1R

17 Q1 0 Crystal 32.768kHz, C(Load) = DNP: Q1 Keep vias free of solder

12.5pF

Q2: 4MHz Buerklin:

18 Q2 0 Crystal DNP: Q2 Keep vias free of solder

78D134

http://www.ettinger.de/Art

Insulating

19 0 Insulating disk to Q2 _Detail.cfm?ART_ARTNU

disk to Q2

M=70.08.121

20 R3, R7 2 330 Ω, SMD0805 541-330ATR-ND

R1, R2, R4,

R6, R8,

21 3 0 Ohm, SMD0805 541-000ATR-ND DNP: R6, R8, R9, R10, R11,R12

R9,R10,

R11, R12

22 R5 1 47k Ω, SMD0805 541-47000ATR-ND

Socket: QFN11T064-006-

23 U1 1 Manuf.: Yamaichi

N-HSP

24 PCB 1 85 x 76 mm 2 layers

for example, 3M

Adhesive Approximately 6mm

25 4 Bumpons Part No. SJ- Apply to corners at bottom side

plastic feet width, 2mm height

5302

26 D3,D4

27 MSP430 2 MSP430F5310 RGC DNP: enclosed with kit, supplied by TI

Hardware SLAU278Q–May 2009–Revised February 2014

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