Datasheet

ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F6137, CC430F6135, CC430F6127, CC430F6126, CC430F6125
CC430F5137, CC430F5135, CC430F5133
SLAS554H –MAY 2009–REVISED SEPTEMBER 2013 www.ti.com
Table 48. Bill of Materials
Components For 315 MHz For 433 MHz For 868, 915 MHz Comment
C1,3,4,5,7,9,11,13,15 100 nF Decoupling capacitors
C8,10,12,14 10 µF Decoupling capacitors
C2,6,16,17,18 2 pF Decoupling capacitors
C19 470 nF V
CORE
capacitor
RST decoupling cap
C20 2.2 nF
(optimized for SBW)
Load capacitors for
C21,22 27 pF
26 MHz crystal
(1)
R1 56 kΩ R_BIAS (±1% required)
R2 47 kΩ RST pullup
L1,2 Capacitors: 220 pF 0.016 µH 0.012 µH
L3,4 0.033 µH 0.027 µH 0.018 µH
L5 0.033 µH 0.047 µH 0.015 µH
L6 dnp
(2)
dnp
(2)
0.0022 µH
L7 0.033 µH 0.051 µH 0.015 µH
C23 dnp
(2)
2.7 pF 1 pF
C24 220 pF 220 pF 100 pF
C25 6.8 pF 3.9 pF 1.5 pF
C26 6.8 pF 3.9 pF 1.5 pF
C27 220 pF 220 pF 1.5 pF
C28 10 pF 4.7 pF 8.2 pF
C29 220 pF 220 pF 1.5 pF
(1) The load capacitance C
L
seen by the crystal is C
L
= 1/((1/C21)+(1/C22)) + C
parasitic
. The parasitic capacitance C
parasitic
includes pin
capacitance and PCB stray capacitance. It can be typically estimated to be approximately 2.5 pF.
(2) dnp = do not populate
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