Datasheet
ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F6137, CC430F6135, CC430F6127, CC430F6126, CC430F6125
CC430F5137, CC430F5135, CC430F5133
SLAS554H –MAY 2009–REVISED SEPTEMBER 2013
www.ti.com
Flash Memory
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
TEST
PARAMETER MIN TYP MAX UNIT
CONDITIONS
DV
CC(PGM/ERASE)
Program and erase supply voltage 1.8 3.6 V
I
PGM
Average supply current from DVCC during program 3 5 mA
I
ERASE
Average supply current from DVCC during erase 2 6.5 mA
Average supply current from DVCC during mass erase or bank
I
MERASE
, I
BANK
2 6.5 mA
erase
t
CPT
Cumulative program time
(1)
16 ms
Program and erase endurance 10
4
10
5
cycles
t
Retention
Data retention duration T
J
= 25°C 100 years
t
Word
Word or byte program time
(2)
64 85 µs
t
Block, 0
Block program time for first byte or word
(2)
49 65 µs
Block program time for each additional byte or word, except for last
t
Block, 1–(N–1)
37 49 µs
byte or word
(2)
t
Block, N
Block program time for last byte or word
(2)
55 73 µs
Erase time for segment erase, mass erase, and bank erase when
t
Erase
23 32 ms
available
(2)
MCLK frequency in marginal read mode
f
MCLK,MGR
0 1 MHz
(FCTL4.MGR0 = 1 or FCTL4. MGR1 = 1)
(1) The cumulative program time must not be exceeded when writing to a 128-byte flash block. This parameter applies to all programming
methods: individual word write, individual byte write, and block write modes.
(2) These values are hardwired into the flash controller's state machine.
JTAG and Spy-Bi-Wire Interface
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER V
CC
MIN TYP MAX UNIT
f
SBW
Spy-Bi-Wire input frequency 2.2 V, 3 V 0 20 MHz
t
SBW,Low
Spy-Bi-Wire low clock pulse duration 2.2 V, 3 V 0.025 15 µs
t
SBW, En
Spy-Bi-Wire enable time (TEST high to acceptance of first clock edge)
(1)
2.2 V, 3 V 1 µs
t
SBW,Rst
Spy-Bi-Wire return to normal operation time 15 100 µs
2.2 V 0 5 MHz
f
TCK
TCK input frequency - 4-wire JTAG
(2)
3 V 0 10 MHz
R
internal
Internal pulldown resistance on TEST 2.2 V, 3 V 45 60 80 kΩ
(1) Tools that access the Spy-Bi-Wire interface need to wait for the minimum t
SBW,En
time after pulling the TEST/SBWTCK pin high before
applying the first SBWTCK clock edge.
(2) f
TCK
may be restricted to meet the timing requirements of the module selected.
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