Datasheet

RF_N
RF_P
AVCC_RF
AVCC_RF
AVCC_RF AVCC_RF
GUARD
C5
C6
C7
C3
C2
C1
C4
R1
C23
L1
L6
L5
L4
L3
L2
C29
C28
C27
C24
C25
C26
L7
SMA STRAIGHT JACK, SMT
R_BIAS
26MHz
C22
C21
RF_XOUT
RF_XIN
VDD
C9
C8
DVCC
VDD
C11
C10
C19
DVCC
VCORE
TDO
TDI/TCLK
TMS
(JTAG / SBW signals)
AVDD
C16
C17
C18
VDD
C14 C15
R2
C20
DVCC
nRST/NMI/SBWTDIO
TCK
TEST/SBWTCK
AVDD
C12 C13
AVCC
AVSS
(May be added close to the respective pins
to reduce emissions at 5GHz to levels
required by ETSI.)
CC430F61xx
17 64
18
63
19
62
20
61
21
60
22
59
29
52
30
51
31
50
32
49
23
58
24 57
25
56
26
55
27 54
28
53
33
16
34
15
35
14
36
13
37
12
38
11
45
4
46
3
47
2
48
1
39
10
40
9
41
8
42
7
43
6
44
5
ECCN 5E002 TSPA - Technology / Software Publicly Available
CC430F6137, CC430F6135, CC430F6127, CC430F6126, CC430F6125
CC430F5137, CC430F5135, CC430F5133
SLAS554H –MAY 2009–REVISED SEPTEMBER 2013 www.ti.com
APPLICATION CIRCUIT
For a complete reference design including layout see the CC430 Wireless Development Tools and related
documentation [MSP430 Hardware Tools User's Guide (SLAU278)].
Figure 27. Typical Application Circuit CC430F61xx
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Product Folder Links: CC430F6137 CC430F6135 CC430F6127 CC430F6126 CC430F6125 CC430F5137
CC430F5135 CC430F5133