Datasheet

PRODUCTPREVIEW
80
0.265
0.235
(0.5) TYP
(0.5) TYP
(
)
METAL
0.25
0.05 MAX
SOLDER MASK
OPENING
METAL
UNDER
MASK
(
)
SOLDER MASK
OPENING
0.25
0.05 MIN
4221325/A 01/2014
NOTES: (continued)
3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
See Texas Instruments Literature No. SBVA017 (www.ti.com/lit/sbva017).
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:15X
C
1
2
3
A
B
D
E
F
G
H
J
4
5
6
7
8
9
NON-SOLDER MASK
DEFINED
(PREFERRED)
NOT TO SCALE
SOLDER MASK DETAILS
SOLDER MASK
DEFINED
ZXH 80 (NFBGA - 1 mm max height)
BALL GRID ARRAY
EXAMPLE BOARD LAYOUT
MSP432P401R, MSP432P401M
www.ti.com SLAS826 –MARCH 2015
Copyright © 2015, Texas Instruments Incorporated Mechanical, Packaging, and Orderable Information 151
Submit Documentation Feedback
Product Folder Links: MSP432P401R MSP432P401M