Datasheet

PRODUCTPREVIEW
C
B
5.1
4.9
A
5.1
4.9
1 MAX
TYP
0.25
0.15
4
TYP
4 TYP
0.5 TYP
0.5 TYP
80X
0.35
0.25
0.7
0.6
4221325/A 01/2014
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis is for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This is a Pb-free solder ball design.
BALL A1 CORNER
INDEX AREA
SEATING PLANE
BALL TYP
0.08 C
J
H
G
F
E
D
C
B
A
1 2
3
0.15 C B A
0.05 C
SYMM
SYMM
4
5
6
7
8
9
ZXH 80 (NFBGA - 1 mm max height)
BALL GRID ARRAY
PACKAGE OUTLINE
MSP432P401R, MSP432P401M
SLAS826 –MARCH 2015 www.ti.com
150 Mechanical, Packaging, and Orderable Information Copyright © 2015, Texas Instruments Incorporated
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