Datasheet

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SBAS203J − MARCH 2002 − REVISED JANUARY 2008
www.ti.com
2
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT FLASH MEMORY PACKAGE MARKING
MSC1210Y2
4k
MSC1210Y2
MSC1210Y2
4k
MSC1210Y2
MSC1210Y3
8k
MSC1210Y3
MSC1210Y3
8k
MSC1210Y3
MSC1210Y4
16k
MSC1210Y4
MSC1210Y4
16k
MSC1210Y4
MSC1210Y5
32k
MSC1210Y5
MSC1210Y5
32k
MSC1210Y5
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this datasheet, or refer to our web site at www.ti.com.
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate
precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to
damage because very small parametric changes could cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
(1)
MSC1210Yx UNITS
Analog Inputs
Input current
Momentary 100 mA
Input current
Continuous 10 mA
Input voltage AGND − 0.3 to AV
DD
+ 0.3 V
Power Supply
DV
DD
to DGND −0.3 to +6 V
AV
DD
to AGND −0.3 to +6 V
AGND to DGND −0.3 to +0.3 V
V
REF
to AGND −0.3 to AV
DD
+ 0.3 V
Digital input voltage to DGND −0.3 to DV
DD
+ 0.3 V
Digital output voltage to DGND −0.3 to DV
DD
+ 0.3 V
Maximum junction temperature 150 °C
Operating temperature range −40 to +125 °C
Storage temperature range −65 to +150 °C
Package power dissipation (T
J
Max − T
AMBIENT
)/q
JA
W
Output current, all pins 200 mA
Output pin short-circuit 10 s
Junction to ambient (q
JA
)
High K (2s 2p) 62.9 °C/W
Thermal Resistance
Junction to ambient (q
JA
)
Low K (1s) 78.2 °C/W
Thermal Resistance
Junction to case (q
JC
) 13.8 °C/W
Digital Outputs
Output current Continuous 100 mA
I/O source/sink current 100 mA
Power pin maximum 300 mA
(1)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for
extended periods may affect device reliability.
MSC1210YX FAMILY FEATURES
FEATURES
(1)
MSC1210Y2
(2)
MSC1210Y3
(2)
MSC1210Y4
(2)
MSC1210Y5
(2)
Flash Program Memory (Bytes) Up to 4k Up to 8k Up to 16k Up to 32k
Flash Data Memory (Bytes) Up to 4k Up to 8k Up to 16k Up to 32k
Internal Scratchpad RAM (Bytes) 256 256 256 256
Internal MOVX RAM (Bytes) 1024 1024 1024 1024
Externally Accessible Memory (Bytes) 64k Program, 64k Data 64k Program, 64k Data 64k Program, 64k Data 64k Program, 64k Data
(1)
All peripheral features are the same on all devices; the flash memory size is the only difference.
(2)
The last digit of the part number (N) represents the onboard flash size = (2
N
)kBytes.