Datasheet

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SBAS317E − APRIL 2004 − REVISED MAY 2006
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2
PACKAGE/ORDERING INFORMATION
(1)
PRODUCT
FLASH MEMORY
(BYTES)
ADC RESOLUTION
(BITS)
PACKAGE
MARKING
MSC1200Y2
4k
24
MSC1200Y2
MSC1200Y2 4k 24 MSC1200Y2
MSC1200Y3
8k
24
MSC1200Y3
MSC1200Y3 8k 24 MSC1200Y3
MSC1201Y2
4k
24
MSC1201Y2
MSC1201Y2 4k 24 MSC1201Y2
MSC1201Y3
8k
24
MSC1201Y3
MSC1201Y3 8k 24 MSC1201Y3
MSC1202Y2
4k
16
MSC1202Y2
MSC1202Y2 4k 16 MSC1202Y2
MSC1202Y3
8k
16
MSC1202Y3
MSC1202Y3 8k 16 MSC1202Y3
(1)
For the most current package and ordering information, see the Package Option Addendum located at the end of this datasheet, or refer to our
web site at www.ti.com.
MSC120x FAMILY FEATURES
FEATURES
(1)
MSC120xY2
(2)
MSC120xY3
(2)
Flash Program Memory (Bytes) Up to 4k Up to 8k
Flash Data Memory (Bytes) Up to 2k Up to 4k
Internal Scratchpad RAM (Bytes) 256 256
(1)
All peripheral features are the same on all devices; the flash memory size
is the only difference.
(2)
The last digit of the part number (N) represents the onboard flash size =
(2
N
)kBytes.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ABSOLUTE MAXIMUM RATINGS
(1)
MSC120x UNITS
Analog Inputs
Input current
Momentary 100 mA
Input current
Continuous 10 mA
Input voltage AGND − 0.3 to AV
DD
+ 0.3 V
Power Supply
DV
DD
to DGND −0.3 to +6 V
AV
DD
to AGND −0.3 to +6 V
AGND to DGND −0.3 to +0.3 V
VREF to AGND −0.3 to AV
DD
+ 0.3 V
Digital input voltage to DGND −0.3 to DV
DD
+ 0.3 V
Digital output voltage to DGND −0.3 to DV
DD
+ 0.3 V
Maximum junction temperature (T
J
Max) +150 °C
Operating temperature range −40 to +125 °C
Storage temperature range −65 to +150 °C
Package power dissipation (T
J
Max − T
AMBIENT
)/q
JA
W
Output current, all pins 200 mA
Output pin short-circuit 10 s
Junction to ambient (q
JA
)
High K (2s 2p) 21.9 °C/W
Thermal resistance
Junction to ambient (q
JA
)
Low K (1s) 103.7 °C/W
Thermal resistance
Junction to case (q
JC
) 21.9 °C/W
Digital Outputs
Output current Continuous 100 mA
I/O source/sink current 100 mA
Power pin maximum 300 mA
(1)
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for
extended periods may affect device reliability.