Datasheet

Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
MAX3232EIDBG4 ACTIVE SSOP DB 16 80 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDBR ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDBRE4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDBRG4 ACTIVE SSOP DB 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDWR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
MAX3232EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
PACKAGE OPTION ADDENDUM
www.ti.com
18-Sep-2008
Addendum-Page 2