Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX3223ECDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3223ECDWR SOIC DW 20 2000 367.0 367.0 45.0
MAX3223ECPWR TSSOP PW 20 2000 367.0 367.0 38.0
MAX3223EIDBR SSOP DB 20 2000 367.0 367.0 38.0
MAX3223EIDWR SOIC DW 20 2000 367.0 367.0 45.0
MAX3223EIPWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2