Datasheet

DRIVER SECTION
ELECTRICAL CHARACTERISTICS
SWITCHING CHARACTERISTICS
ESD PROTECTION
MAX208
SLLS596C OCTOBER 2003 REVISED AUGUST 2009 ................................................................................................................................................
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C1 to C4 = 0.1 µ F at V
CC
= 5 V ± 0.5 V (see Figure 4 ), over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
V
OH
High-level output voltage DOUT at R
L
= 3 k to GND, DIN = GND 5 9 V
V
OL
Low-level output voltage DOUT at R
L
= 3 k to GND, DIN = V
CC
5 9 V
I
IH
High-level input current V
I
= V
CC
15 200 µ A
I
IL
Low-level input current V
I
= 0 V 15 200 µ A
I
OS
Short-circuit output current
(1)
V
CC
= 5.5 V, V
O
= 0 V ± 10 ± 60 mA
r
o
Output resistance V
CC
, V+, and V = 0 V, V
O
= ± 2 V 300
(1) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
C1 to C4 = 0.1 µ F at V
CC
= 5 V ± 0.5 V (see Figure 4 ), over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP
(1)
MAX UNIT
C
L
= 50 to 1000 pF, One DOUT switching, R
L
= 3 k to 7
Maximum data rate 120 kbit/s
k , See Figure 1
Propagation delay time,
t
PLH (D)
C
L
= 2500 pF, All drivers loaded, R
L
= 3 k , See Figure 1 2 µ s
low- to high-level output
Propagation delay time,
t
PHL (D)
C
L
= 2500 pF, All drivers loaded, R
L
= 3 k , See Figure 1 2 µ s
high- to low-level output
t
sk(p)
Pulse skew
(2)
C
L
= 150 pF to 2500 pF, See Figure 2 300 ns
Slew rate, transition region
SR(tr) C
L
= 50 pF to 2500 pF, R
L
= 3 k to 7 k , V
CC
= 5 V 3 6 30 V/ µ s
(see Figure 1 )
(1) All typical values are at V
CC
= 5 V and T
A
= 25 ° C.
(2) Pulse skew is defined as |t
PLH
t
PHL
| of each channel of the same device.
PIN TEST CONDITIONS TYP UNIT
DOUT, RIN Human-Body Model ± 15 kV
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