Datasheet

PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing
Pins Package
Qty
Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
MAX208CDB ACTIVE SSOP DB 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C
MAX208CDBG4 ACTIVE SSOP DB 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C
MAX208CDBR ACTIVE SSOP DB 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C
MAX208CDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MA208C
MAX208CDW ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C
MAX208CDWE4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C
MAX208CDWG4 ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C
MAX208CDWR ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C
MAX208CDWRE4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C
MAX208CDWRG4 ACTIVE SOIC DW 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX208C
MAX208IDB ACTIVE SSOP DB 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I
MAX208IDBE4 ACTIVE SSOP DB 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I
MAX208IDBG4 ACTIVE SSOP DB 24 60 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I
MAX208IDBR ACTIVE SSOP DB 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I
MAX208IDBRE4 ACTIVE SSOP DB 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I
MAX208IDBRG4 ACTIVE SSOP DB 24 2000 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB208I
MAX208IDW ACTIVE SOIC DW 24 25 Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX208I