Datasheet
±
SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYP
†
MAX UNIT
V
OH
High-level output voltage D
OUT
at R
L
= 3 kΩ to GND, D
IN
= GND 5 9 V
V
OL
Low-level output voltage D
OUT
at R
L
= 3 kΩ to GND, D
IN
= V
CC
−5 −9 V
I
IH
High-level input current V
I
= V
CC
15 200 µA
I
IL
Low-level input current V
I
at 0 V −15 −200 µA
I
OS
‡
Short-circuit output current V
CC
= 5.5 V, V
O
= 0 V ±10 ±60 mA
r
o
Output resistance V
CC
, V+, and V− = 0 V, V
O
= ±2 V 300 W
†
All typical values are at V
CC
= 5 V, and T
A
= 25°C.
‡
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V ± 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 4)
PARAMETER TEST CONDITIONS MIN TYP
†
MAX UNIT
Maximum data rate
C
L
= 50 to 1000 pF,
One D
OUT
switching,
R
L
= 3 kΩ to 7 kΩ,
See Figure 1
120 kbit/s
t
PLH
(D)
Propagation delay time,
low- to high-level output
C
L
= 2500 pF,
all drivers loaded,
R
L
= 3 kΩ,
See Figure 1
2 µs
t
PHL
(D)
Propagation delay time,
high- to low-level output
C
L
= 2500 pF,
all drivers loaded,
R
L
= 3 kΩ,
See Figure 1
2 µs
t
sk(p)
Pulse skew
§
C
L
= 150 pF to 2500 pF, R
L
= 3 kΩ to 7 kΩ,
See Figure 2
300 ns
SR(tr)
Slew rate, transition region
(see Figure 1)
C
L
= 50 pF to 1000 pF
V
CC
= 5 V
R
L
= 3 kΩ to 7 kΩ,
3 6 30 V/µs
†
All typical values are at V
CC
= 5 V, and T
A
= 25°C.
§
Pulse skew is defined as |t
PLH
− t
PHL
| of each channel of the same device.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 5 V ± 0.5 V.
ESD protection
PIN TEST CONDITIONS TYP UNIT
D
OUT
, R
IN
Human-Body Model ±15 kV