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 ±  

SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

D ESD Protection for RS-232 I/O Pins

− ±15 kV − Human-Body Model

D Meets or Exceeds the Requirements of

TIA/EIA-232-F and ITU v.28 Standards

D Operates at 5-V V

Supply

D Operates Up To 120 kbit/s

D External Capacitors ...4 × 0.1 µF

D Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

D Applications

− Battery-Powered Systems, PDAs,

Notebooks, Laptops, Palmtop PCs, and

Hand-Held Equipment

description/ordering information

The MAX207 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD

protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of

TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and

the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V

supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs driver output

slew rate.

ORDERING INFORMATION

PACKAGE

†

ORDERABLE

PART NUMBER

TOP-SIDE

MARKING

SOIC (DW)

Tube of 25 MAX207CDW

MAX207C

0°C to 70°C

SOIC (DW)

Reel of 2000 MAX207CDWR

MAX207C

0 C to 70 C

SSOP (DB) Reel of 2000 MAX207CDBR MA207C

SOIC (DW)

Tube of 25 MAX207IDW

MAX207I

−40°C to 85°C

SOIC (DW)

Reel of 2000 MAX207IDWR

MAX207I

−40 C to 85 C

SSOP (DB) Reel of 2000 MAX207IDBR MB207I

†

Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

available at www.ti.com/sc/package.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

DB OR DW PACKAGE

(TOP VIEW)

DOUT3

DOUT1

DOUT2

RIN1

ROUT1

DIN2

DIN1

GND

C1+

V+

C1−

DOUT4

RIN2

ROUT2

DIN5

DOUT5

DIN4

DIN3

ROUT3

RIN3

V−

C2−

C2+

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Summary of content (17 pages)

PAGE 1
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 D ESD Protection for RS-232 I/O Pins D D D D D D DB OR DW PACKAGE (TOP VIEW) − ±15 kV − Human-Body Model Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Operates Up To 120 kbit/s External Capacitors . . . 4 × 0.
PAGE 2
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 Function Tables EACH DRIVER INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level EACH RECEIVER INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off logic diagram (positive logic) 7 2 DIN1 DOUT1 6 3 DIN2 TTL/CMOS Inputs DOUT2 18 1 DIN3 DOUT3 19 24 DIN4 DOUT4 21 20 DIN5 DOUT5 5 4 ROUT1 TTL/CM
PAGE 3
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive charge pump voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC − 0.
PAGE 4
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS MIN TYP† VOH VOL High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 9 Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC −5 −9 IIH IIL High-level input current L
PAGE 5
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS VOH VOL High-level output voltage VIT+ VIT− Positive-going input threshold voltage Vhys ri Input hysteresis (VIT+ − VIT−) MIN TYP† 3.5 VCC−0.4 V IOH = −1 mA IOL = 1.
PAGE 6
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL (D) tPLH (D) VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2.
PAGE 7
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION DOUT3 DOUT1 1 24 2 23 DOUT4 RIN2 5 kΩ 22 3 DOUT2 4 RIN1 ROUT2 5V 5 kΩ 400 kΩ 21 5 ROUT1 20 5V 400 kΩ 400 kΩ 19 5V GND 400 kΩ 7 18 8 17 + CBYPASS − = 0.1µF DIN4 5V 400 kΩ DIN1 DOUT5 5V 6 DIN2 DIN5 16 DIN3 ROUT3 RIN3 C4 = 0.1 µF 16 V 5 kΩ 9 C3 † = 0.1 µF 6.3 V VCC V− − + 10 11 C1 = 0.1 µF 6.
PAGE 8
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION capacitor selection The capacitor type used for C1−C4 is not critical for proper operation. The MAX207 requires 0.1-µF capacitors, although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF capacitors.
PAGE 9
± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION 1.5 VHBM = 2 kV DUT = 10-V, 1-Ω Zener Diode I DUT − A 1.0 0.5 0.0 0 50 100 150 200 Time − ns Figure 6. Typical HBM Current Waveform Machine Model The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance.
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PACKAGE OPTION ADDENDUM www.ti.
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PACKAGE OPTION ADDENDUM www.ti.
PAGE 12
PACKAGE OPTION ADDENDUM www.ti.com 11-Apr-2013 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties.
PAGE 13
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing MAX207CDWR SOIC MAX207IDBR MAX207IDWR SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 15.7 2.7 12.0 24.0 Q1 DW 24 2000 330.0 24.4 SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 Pack Materials-Page 1 10.
PAGE 14
PACKAGE MATERIALS INFORMATION www.ti.com 8-Apr-2013 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX207CDWR SOIC DW 24 2000 367.0 367.0 45.0 MAX207IDBR SSOP DB 24 2000 367.0 367.0 38.0 MAX207IDWR SOIC DW 24 2000 367.0 367.0 45.
PAGE 15
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MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters.
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IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.