Datasheet

LPV7215
SNOSAI6I –SEPTEMBER 2005–REVISED APRIL 2013 www.ti.com
ABSOLUTE MAXIMUM RATINGS
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
V
IN
Differential ±2.5V
Supply Voltage (V
+
- V
−
) 6V
Voltage at Input/Output pins V
+
+0.3V, V
−
−0.3V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
+150°C
Soldering Information Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
OPERATING RATINGS
(1)
Temperature Range
(2)
−40°C to 125°C
Supply Voltage (V
+
– V
−
) 1.8V to 5.5V
Package Thermal Resistance (θ
JA
(2)
) 5-Pin SC70 456°C/W
5-Pin SOT-23 234°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
1.8V ELECTRICAL CHARACTERISTICS
(1)
Unless otherwise specified, all limits are specified for T
A
= 25°C, V
+
= 1.8V, V
−
= 0V, and V
CM
= V
+
/2, V
O
= V
−
. Boldface limits
apply at the temperature extremes.
Symbol Parameter Conditions Min
(2)
Typ
(3)
Max
(2)
Units
I
S
Supply Current V
CM
= 0.3V 580 750
1050
nA
V
CM
= 1.5V 790 980
1300
V
OS
Input Offset Voltage V
CM
= 0V ±0.3 ±6
±8
mV
V
CM
= 1.8V ±0.4 ±5
±7
TCV
OS
Input Offset Average Drift See
(4)
±1 μV/C
I
B
Input Bias Current
(5)
V
CM
= 1.6V −40 fA
I
OS
Input Offset Current 10 fA
(1) Electrical table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions result in very
limited self-heating of the device.
(2) Limits are 100% production tested at 25°C. Limits over the operating temperature range are specified through correlations using
statistical quality control (SQC) method.
(3) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not specified on shipped
production material.
(4) Offset voltage average drift determined by dividing the change in V
OS
at temperature extremes into the total temperature change.
(5) Positive current corresponds to current flowing into the device.
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