Datasheet
LPV531
SNOSAK5B –MARCH 2006–REVISED MARCH 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
V
IN
Differential ±2V
Supply Voltage (V
+
- V
−
) 6V
Storage Temperature Range −65°C to +150°C
Junction Temperature
(4)
+150°C
Soldering Information
Infrared or Convection (20 sec) 235°C
Wave Soldering Lead Temp. (10 sec) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human Body Model is 1.5 kΩ in series with 100 pF. Machine Model is 0Ω in series with 200 pF.
(4) Typical values represent the most likely parametric norm.
Operating Ratings
(1)
Operating Temperature Range −40°C to +85°C
Supply Voltage (V
+
– V
−
) 2.7V to 5.5V
Package Thermal Resistance (θ
JA
)
(2)
6-Pin SOT 171°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not ensured. For ensured specifications and the test
conditions, see the Electrical Characteristics Tables.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(MAX)
- T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC board.
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