Datasheet

LPV521
SNOSB14C –AUGUST 2009–REVISED FEBRUARY 2013 www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
ESD Tolerance
(3)
Human Body Model 2000V
Machine Model 200V
Charge-Device Model 1000V
Any pin relative to V
-
6V, −0.3V
IN+, IN-, OUT Pins V
+
+ 0.3V, V
–
– 0.3V
V
+
, V
-
, OUT Pins 40mA
Differential Input Voltage (V
IN+
- V
IN-
) ±300 mV
Storage Temperature Range −65°C to 150°C
Junction Temperature
(4)
150°C
Mounting Temperature Infrared or Convection (30 sec.) 260°C
Wave Soldering Lead Temp. (4 sec.) 260°C
(1) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and test conditions, see the
Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office / Distributors for availability and
specifications.
(3) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC)Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(4) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
Operating Ratings
(1)
Temperature Range
(2)
−40°C to 125°C
Supply Voltage (V
S
= V
+
- V
−
) 1.6V to 5.5V
Package Thermal Resistance (θ
JA
)
(2)
5-Pin SC70 456 °C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and test conditions, see the
Electrical Characteristics.
(2) The maximum power dissipation is a function of T
J(MAX)
, θ
JA
. The maximum allowable power dissipation at any ambient temperature is
P
D
= (T
J(MAX)
– T
A
)/ θ
JA
. All numbers apply for packages soldered directly onto a PC Board.
2 Submit Documentation Feedback Copyright © 2009–2013, Texas Instruments Incorporated
Product Folder Links: LPV521