Datasheet

LP4950C-5V, LP4951C
SNVS208C SEPTEMBER 2002REVISED APRIL 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS
(1)
Input Supply Voltage 0.3 to +30V
SHUTDOWN Input Voltage, 0.3 to +30V
Error Comparator Output
Voltage,
(2)
FEEDBACK Input Voltage
(2) (3)
1.5 to +30V
Power Dissipation Internally Limited
Junction Temperature (T
J
) +150°C
Ambient Storage Temperature 65° to +150°C
ESD Rating
Human Body Model
(4)
2 kV
For soldering specifications, see the following document: www.ti.com/lit/snoa549
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) May exceed input supply voltage.
(3) When used in dual-supply systems where the output terminal sees loads returned to a negative supply, the output voltage should be
diode-clamped to ground.
(4) Human Body Model 1.5 k in series with 100 pF. LP4950 - passes 2 kV HBM. LP4951 - All pins pass 2 kV except Vfb -1000V.
OPERATING RATINGS
(1)
Maximum Input Supply Voltage 30V
Junction Temperature Range
(2)
LP4950C, LP4951C 40°C to 125°C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions under which
operation of the device is specified. Operating Ratings do not imply specified performance limits. For specified performance limits and
associated test conditions, see the Electrical Characteristics tables.
(2) The junction-to-ambient thermal resistances are as follows: 180°C/W and 160°C/W for the TO-92 package with 0.40 inch and 0.25 inch
leads to the printed circuit board (PCB) respectively, 160°C/W for the molded plastic SOIC (D). The above thermal resistances for the
SOIC package apply when the package is soldered directly to the PCB.
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