Datasheet

LP3997
www.ti.com SNVS272B –MAY 2004–REVISED MAY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1) (2)(3)
Input Voltage -0.3 to 6.5V
Output Voltage -0.3 to (V
IN
+ 0.3V) with 6.5V (max)
SD Input Voltage -0.3 to (V
IN
+ 0.3V) with 6.5V (max)
Junction Temperature 150°C
Lead/Pad Temp.
VSSOP 260°C
Storage Temperature -65 to 150°C
Continuous Power Dissipation Internally Limited
(4)
Human Body Model
(5)
2KV
All Pins Except C
BYP
Machine Model 200V
ESD
Human Body Model
(5)
1KV
C
BYP
Pin
Machine Model 100V
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) All Voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) Internal thermal shutdown circuitry protects the device from permanent damage.
(5) The human body model is 100pF discharged through a 1.5kΩ resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.
Operating Ratings
(1)
Input Voltage 2V to 6V
Junction Temperature -40°C to 125°C
Ambient Temperature T
A
Range
(2)
-40°C to 85°C
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) The maximum ambient temperature (T
A(max)
) is dependant on the maximum operating junction temperature (T
J(max-op)
= 125°C), the
maximum power dissipation of the device in the application (P
D(max)
), and the junction to ambient thermal resistance of the part/package
in the application (θ
JA
), as given by the following equation: T
A(max)
= T
J(max-op)
- (θ
JA
× P
D(max)
).
Thermal Properties
(1)
Junction To Ambient Thermal Resistance
(2)
, θ
JA
(VSSOP) 210°C/W
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power
dissipation is possible, special care must be paid to thermal dissipation issues in board design.
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