Datasheet

LP3991
www.ti.com
SNVS296H DECEMBER 2006REVISED MAY 2013
Absolute Maximum Ratings
(1)(2)(3)
V
IN
, V
OUT
, Pins: Voltage to GND -0.3 to 6.5V
V
EN
Pin: Voltage to GND -0.3 to (V
IN
+ 0.3V) to 6.5V (max)
Junction Temperature 150°C
Lead/Pad Temperature
(4)
DSBGA 260°C
Storage Temperature -65 to 150°C
Continuous Power Dissipation
(5)
Internally Limited
ESD
(6)
Human Body Model 2KV
Machine Model 200V
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) All Voltages are with respect to the potential at the GND pin.
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(4) For further information on these packages please refer to the following application notes, AN-1112 DSBGA Wafer Level Chip Scale
Package (SNVA009).
(5) Internal thermal shutdown circuitry protects the device from permanent damage.
(6) The human body model is 100pF discharged through a 1.5k resistor into each pin. The machine model is a 200pF capacitor
discharged directly into each pin.
Operating Ratings
(1)
Input Voltage Range 1.65 to 4.0V
Recommended Load Current 300mA
Junction Temperature -40°C to 125°C
Ambient Temperature T
A
Range
(2)
-40°C to 85°C
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) The maximum ambient temperature (T
A(max)
) is dependant on the maximum operating junction temperature (T
J(max-op)
= 125°C), the
maximum power dissipation of the device in the application (P
D(max)
), and the junction to ambient thermal resistance of the part /
package in the application (θ
JA
), as given by the following equation: T
A(max)
= T
J(max-op)
- (θ
JA
× P
D(max)
).
Thermal Properties
(1)
Junction To Ambient Thermal Resistance
(2)
θ
JA
JEDEC Board
(3)
88°C/W
θ
JA
4 Layer Board 160°C/W
(1) Absolute Maximum Ratings are limits beyond which damage can occur. Operating Ratings are conditions under which operation of the
device is ensured. Operating Ratings do not imply ensured performance limits. For ensured performance limits and associated test
conditions, see the Electrical Characteristics tables.
(2) Junction to ambient thermal resistance is dependant on the application and board layout. In applications where high maximum power
dissipation is possible, special care must be paid to thermal dissipation issues in board design.
(3) Full details can be found in JESD61-7
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