Datasheet

LP3972
SNVS468K –SEPTEMBER 2006–REVISED MAY 2013 www.ti.com
Operating Ratings
V
IN
2.7V to 5.5V
V
IN
LDO4, 5 1.74 to V
IN
Junction Temperature (T
J
) −40°C to +125°C
Operating Temperature (T
A
) −40°C to +85°C
Maximum Power Dissipation (T
A
= 70°C)
(1)(2)
2.2W
(1) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-
OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance
of the part/package in the application (θ
JA
), as given by the following equation: TA-MAX = TJ-MAX-OP – (θ
JA
x PD-MAX).
(2) Junction-to-ambient thermal resistance (θ
JA
) is taken from a thermal modeling result, performed under the conditions and guidelines set
forth in the JEDEC standard JESD51–7. The test board is a 4-layer FR-4 board measuring 102 mm x 76 mm x 1.6 mm with a 2x1 array
of thermal vias. The ground plane on the board is 50 mm x 50 mm. Thickness of copper layers are 36 µm/1.8 µm/18 µm/36 µm (1.5 oz/1
oz/1 oz/1.5 oz). Ambient temperature in simulation is 22°C, still air. Power dissipation is 1W. Junction-to-ambient thermal resistance is
highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid
to thermal dissipation issues in board design. The value of θ
JA
of this product can vary significantly, depending on PCB material, layout,
and environmental conditions. In applications where high maximum power dissipation exists (high V
IN
, high I
OUT
), special care must be
paid to thermal dissipation issues. For more information on these topics, see Application Note AN-1187 Leadless Leadframe Package
(LLP)(SNOA401) and the Power Efficiency and Power Dissipation sections of this datasheet.
General Electrical Characteristics
Typical values and limits appearing in normal type apply for T
J
= 25°C. Limits appearing in boldface type apply over the
entire junction temperature range for operation, −40°C to +125°C
(1)(2)(3)
Symbol Parameter Test Conditions Min Typ Max Unit
V
IN
, VDDA, V
IN
Buck1, 2 and 3 Battery Voltage 2.7 3.6 5.5 V
V
IN
LDO4, V
IN
LDO5 Power Supply for LDO 4 and 5 1.74 3.6 V
IN
V
T
SD
Thermal Shutdown
(4)
Temperature 160
°C
Hysteresis 20
(1) All voltages are with respect to the potential at the GND pin.
(2) All limits specified at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are
production tested, ensured through statistical analysis or ensured by design. All limits at temperature extremes are ensured via
correlation using standard Statistical Quality Control (SQC) methods. All limits are used to calculate Average Outgoing Quality Level
(AOQL).
(3) No input supply should be higher then VDDA
(4) This electrical specification is ensured by design.
Supply Specifications
(1)(2)
V
OUT
(Volts) I
MAX
: Maximum Current
Supply Range Resolution
Current (mA)
(V) (mV)
LDO_RTC 2.8V N/A 30 mA dc source 10 mA backup source
LDO1 (V
CC
_MVT) 1.7 to 2.0 25 300
LDO2 1.8 to 3.3 100 150
LDO3 1.8 to 3.3 100 150
LDO4 1.0 to 3.3 50-600 150
LDO5 (V
CC
_SRAM) 0.850 to 1.5 25 400
BUCK1 (V
CC
_APPS) 0.725 to 1.5 25 1600
BUCK2 0.8 to 3.3 50-600 1600
BUCK3 0.8 to 3.3 50-600 1600
(1) All voltages are with respect to the potential at the GND pin.
(2) The Human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin. (MIL-STD-883 3015.7) The machine
model is a 200 pF capacitor discharged directly into each pin. (EAIJ).
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