Datasheet

LP3962, LP3965
SNVS066H –MAY 2000–REVISED APRIL 2013 www.ti.com
Figure 25. Maximum power dissipation vs ambient temperature for SFM/TO-263 package
Figure 26 shows a curve for the θ
JA
of SOT-223 package for different copper area sizes, using a typical PCB with
1 ounce copper and no solder mask over the copper area for heat sinking.
Figure 26. θ
JA
vs Copper(1 Ounce) Area for SOT-223 package
Figure 27 through Figure 35 show different layout scenarios for SOT-223 package.
Figure 27. SCENARIO A, θ
JA
= 148°C/W
Figure 28. SCENARIO B, θ
JA
= 125°C/W
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