Datasheet

TAB
IS
GND
BIAS
OUT
GND
SS 1
2
3
4
5
IN
LP38858S-x.x
TAB
IS
GND
BIAS
OUT
GND
SS 1
2
3
4
5
IN
LP38858T-x.x
LP38858
SNVS462D OCTOBER 2006REVISED APRIL 2013
www.ti.com
Connection Diagram
Figure 1. DDPAK/TO-263–5 Package (Top View) Figure 2. TO220–5 Package (Top View)
See Package Number KTT0005B See Package Number NDH0005D
Pin Descriptions
TO-220–5 and DDPAK/TO-263–5 Packages
Pin # Pin Symbol Pin Description
1 SS Soft-Start capacitor connection. Used to slow the rise time of V
OUT
at turn-on.
2 IN The unregulated voltage input pin.
3 GND Ground
4 OUT The regulated output voltage pin.
5 BIAS The supply for the internal control and reference circuitry.
The TAB is a thermal connection that is physically attached to the backside of the
TAB TAB die, and used as a thermal heat-sink connection. See the Application Information
section for details.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Storage Temperature Range 65°C to +150°C
Lead Temperature Soldering, 5 seconds 260°C
ESD Rating Human Body Model
(3)
±2 kV
Power Dissipation
(4)
Internally Limited
V
IN
Supply Voltage (Survival) 0.3V to +6.0V
V
BIAS
Supply Voltage (Survival) 0.3V to +6.0V
V
SS
Soft-Start Voltage (Survival) 0.3V to +6.0V
V
OUT
Voltage (Survival) 0.3V to +6.0V
I
OUT
Current (Survival) Internally Limited
Junction Temperature 40°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114. The
HBM rating for device pin 1 (SS) is ±1.5 kV.
(4) Device power dissipation must be de-rated based on device power dissipation (P
D
), ambient temperature (T
A
), and package junction to
ambient thermal resistance (θ
JA
). Additional heat-sinking may be required to ensure that the device junction temperature (T
J
) does not
exceed the maximum operating rating. See the Application Information section for details.
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