Datasheet

TAB
IS
GND
BIAS
OUT
GND
EN 1
2
3
4
5
IN
LP38856S-x.x
TAB
IS
GND
BIAS
OUT
GND
EN 1
2
3
4
5
IN
LP38856T-x.x
LP38856
SNVS336E –JUNE 2006–REVISED APRIL 2013 www.ti.com
Connection Diagram
Figure 1. DDPAK/TO-263 – Top View Figure 2. TO-220 – Top View
See Package Number KTT0005B See Package Number NDH0005D
PIN DESCRIPTIONS
TO-220–5 and DDPAK/TO-263–5 Packages
Pin # Pin Symbol Pin Description
1 EN The device Enable pin.
2 IN The unregulated input voltage pin
3 GND Ground
4 OUT The regulated output voltage pin
5 BIAS The supply for the internal control and reference circuitry
The TAB is a thermal connection that is physically attached to the backside of the
TAB TAB die, and is used as a thermal heat-sink connection. See the Application Information
section for details
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Storage Temperature Range −65°C to +150°C
Lead Temperature Soldering, 5 seconds 260°C
ESD Rating Human Body Model
(3)
±2 kV
Power Dissipation
(4)
Internally Limited
V
IN
Supply Voltage (Survival) −0.3V to +6.0V
V
BIAS
Supply Voltage (Survival) −0.3V to +6.0V
V
EN
Voltage (Survival) −0.3V to +6.0V
V
OUT
Voltage (Survival) −0.3V to +6.0V
I
OUT
Current (Survival) Internally Limited
Junction Temperature −40°C to +150°C
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Operating ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications, see Electrical
Characteristics. Specifications do not apply when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The Human Body Model (HBM) is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-
A114. The HBM rating for device pin 1 (EN) is ±1.5 kV.
(4) Device power dissipation must be de-rated based on device power dissipation (T
D
), ambient temperature (T
A
), and package junction to
ambient thermal resistance (θ
JA
). Additional heat-sinking may be required to ensure that the device junction temperature (T
J
) does not
exceed the maximum operating rating. See the Application Information section for details.
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