Datasheet
LP38853
www.ti.com
SNVS335D –DECEMBER 2006–REVISED APRIL 2013
PIN DESCRIPTIONS (continued)
SO PowerPAD-
PFM-7 DDPAK-7 Pin
8 Pin Description
Pin # Pin # Symbol
Pin #
The SO PowerPAD DAP is a thermal connection only that is
physically attached to the backside of the die, and used as a
- - DAP DAP
thermal heat-sink connection. See the Application Information
section for details.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings
(1)(2)
Storage Temperature Range −65°C to +150°C
Lead Temperature Soldering, 5 seconds 260°C
ESD Rating Human Body Model
(3)
±2 kV
Power Dissipation
(4)
Internally Limited
V
IN
Supply Voltage (Survival) −0.3V to +6.0V
V
BIAS
Supply Voltage (Survival) −0.3V to +6.0V
V
SS
SoftStart Voltage (Survival) −0.3V to +6.0V
V
OUT
Voltage (Survival) −0.3V to +6.0V
I
OUT
Current (Survival) Internally Limited
Junction Temperature −40°C to +150°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The human body model is a 100 pF capacitor discharged through a 1.5k resistor into each pin. Test method is per JESD22-A114.
(4) Device power dissipation must be de-rated based on device power dissipation (P
D
), ambient temperature (T
A
), and package junction to
ambient thermal resistance (θ
JA
). Additional heat-sinking may be required to ensure that the device junction temperature (T
J
) does not
exceed the maximum operating rating. See the Application Information section for details.
Operating Ratings
(1)
V
IN
Supply Voltage (V
OUT
+ V
DO
) to V
BIAS
V
BIAS
Supply Voltage 0.8V ≤ V
OUT
≤ 1.2V 3.0V to 5.5V
1.2V < V
OUT
≤ 1.8V 4.5V to 5.5V
V
EN
Voltage 0.0V to V
BIAS
I
OUT
0 mA to 3.0A
Junction Temperature Range
(2)
−40°C to +125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not ensure specific performance limits. For ensured specifications and conditions,
see the Electrical Characteristics.
(2) Device power dissipation must be de-rated based on device power dissipation (P
D
), ambient temperature (T
A
), and package junction to
ambient thermal resistance (θ
JA
). Additional heat-sinking may be required to ensure that the device junction temperature (T
J
) does not
exceed the maximum operating rating. See the Application Information section for details.
Copyright © 2006–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: LP38853