Datasheet

DAP
Connect to GND
IN
EN
N/C
SS5
6
7
8
OUT
ADJ
GND
BIAS
1
2
3
4
TAB
IS
GND
LP38853S-ADJ
BIAS
OUT
GND
SS 1
2
3
4
5
IN
6
7
ADJ
EN
TAB
IS
GND
LP38853T-ADJ
BIAS
OUT
GND
SS 1
2
3
4
5
IN
6
7
ADJ
EN
IN
BIAS
GND
OUT
V
OUT
V
IN
V
BIAS
C
IN
10 PF Ceramic
C
OUT
10 PF
Ceramic
C
BIAS
1 PF
GND
GND
LP38853-ADJ
ADJ
R1
R2
C
FF
V
EN
SS
C
SS
EN
LP38853
SNVS335D –DECEMBER 2006–REVISED APRIL 2013 www.ti.com
Typical Application Circuit
Connection Diagram
Figure 1. DDPAK-7 – Top View Figure 2. PFM – Top View
See Package Number KTW0007B See Package Number NDZ0007B
Figure 3. SO PowerPAD-8 – Top View
See Package Number DDA0008A
PIN DESCRIPTIONS
SO PowerPAD-
PFM-7 DDPAK-7 Pin
8 Pin Description
Pin # Pin # Symbol
Pin #
Soft-Start capacitor connection. Used to control the rise time of
1 1 5 SS
V
OUT
at turn-on.
2 2 6 EN Device Enable, High = On, Low = Off.
3 3 7 IN The unregulated voltage input
4 4 4 GND Ground
5 5 1 ADJ The feedback connection to set the output voltage
6 6 2 OUT The regulated output voltage
7 7 3 BIAS The supply for the internal control and reference circuitry.
- - 8 N/C No internal connection
The PFM and DDPAK TAB is a thermal and electrical connection
that is physically attached to the backside of the die, and used as a
TAB TAB - TAB
thermal heat-sink connection. See the Application Information
section for details.
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