Datasheet

DAP
Connect to GND
IN
EN
N/C
SS5
6
7
8
OUT
ADJ
GND
BIAS
1
2
3
4
TAB
IS
GND
LP38852S-ADJ
BIAS
OUT
GND
SS 1
2
3
4
5
IN
6
7
ADJ
EN
TAB
IS
GND
LP38852T-ADJ
BIAS
OUT
GND
SS 1
2
3
4
5
IN
6
7
ADJ
EN
LP38852
SNVS482E –JANUARY 2007–REVISED APRIL 2013 www.ti.com
Connection Diagrams
Top View Top View
Figure 1. DDPAK-7 Package Figure 2. TO-220-7 Package
See Package Number KTW0007B See Package Number NDZ0007B
Top View
Figure 3. SO PowerPAD-8 Package
See Package Number DDA0008A
Pin Descriptions
TO-220-7 and DDPAK-7 Packages
TO-220–7 DDPAK–7 SO PowerPAD-8 Pin
Pin Description
Pin # Pin # Pin # Symbol
Soft-Start capacitor connection. Used to slow the rise time of V
OUT
at
1 1 5 SS
turn-on.
2 2 6 EN Device Enable, High = On, Low = Off.
3 3 7 IN The unregulated voltage input
4 4 4 GND Ground
5 5 1 ADJ The feedback connection to set the output voltage
6 6 2 OUT The regulated output voltage
7 7 3 BIAS The supply for the internal control and reference circuitry.
- - 8 N/C No internal connection
The TAB is a thermal and electrical connection that is physically
TAB TAB - TAB attached to the backside of the die, and used as a thermal heat-sink
connection. See the Application Informationsection for details.
The DAP is a thermal connection only that is physically attached to
- - DAP DAP the backside of the die, and used as a thermal heat-sink connection.
See the Application Information section for details.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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