Datasheet

LP38852
www.ti.com SNVS482E –JANUARY 2007–REVISED APRIL 2013
Figure 34. Maximum Power Dissipation vs Ambient Temperature for the DDPAK Package
Figure 34 shows the maximum allowable power dissipation for DDPAK packages for different ambient
temperatures, assuming θ
JA
is 35°C/W and the maximum junction temperature is 125°C.
Heat-Sinking the SO PowerPAD-8 Package
The LP38852MR package has a θ
JA
rating of 168°C/W, and a θ
JC
rating of 11°C/W. The θ
JA
rating of 168°C/W
includes the device DAP soldered to an area of 0.008 square inches (0.09 in x 0.09 in) of 1 ounce copper, with
no airflow.
Figure 35. θ
JA
vs Copper (1 Ounce) Area for the SO PowerPAD-8 Package
Increasing the copper area soldered to the DAP to 1 square inch of 1 ounce copper, using a dog-bone type
layout, will improve the θ
JA
rating to 98°C/W. Figure 35 shows that increasing the copper area beyond 1 square
inch produces very little improvement.
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