Datasheet

V
IN
2
3
4
5
6
1
GND
N/C
ADJ
V
OUT
V
IN
Exposed Pad
on Bottom
(DAP)
V
IN
2
3
4
5
6
1
GND
V
EN
ADJ
V
OUT
V
IN
Exposed Pad
on Bottom
(DAP)
ADJ
V
OUT
GND
V
EN
V
IN
1
2
4
3
5
LP38690-ADJ, LP38692-ADJ
SNVS323H –DECEMBER 2004–REVISED APRIL 2013 www.ti.com
Connection Diagrams
Figure 1. SOT-223 (LP38692MP-ADJ) – Top View
See Package Number NDC0005A
Figure 2. 6-Lead WSON (LP38690SD-ADJ) – Top Figure 3. 6-Lead WSON (LP38692SD-ADJ) Top
View View
See Package Number NGG0006A See Package Number NGG
PIN DESCRIPTIONS
Pin Description
V
IN
This is the input supply voltage to the regulator. For WSON package devices, both V
IN
pins must be tied
together for full current operation (500mA maximum per pin).
GND Circuit ground for the regulator. For the SOT-223 package this is thermally connected to the die and functions
as a thermal connection when the soldered down to a large copper plane.
V
OUT
Regulated output voltage.
V
EN
The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.
ADJ The adjust pin is used to set the regulated output voltage by connecting it to the external resistors R1 and R2
(see Typical Application Circuits).
DAP WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane.
See WSON MOUNTING section in APPLICATION HINTS for more information.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Product Folder Links: LP38690-ADJ LP38692-ADJ