Datasheet

V
IN
2
3
4
5
6
1
GND
N/C
V
OUT
SNS
V
IN
Exposed Pad
on Bottom
(DAP)
V
IN
2
3
4
5
6
1
GND
V
EN
V
OUT
SNS
V
IN
Exposed Pad
on Bottom
(DAP)
N/C
V
OUT
GND
V
EN
V
IN
1
2
4
3
5
LP38690, LP38692
SNVS322J –DECEMBER 2004–REVISED APRIL 2013 www.ti.com
Connection Diagram
Figure 1. PFM (LP38690DT-X.X) – Top View Figure 2. SOT-223 (LP38692MP-X.X) – Top View
See Package Number NDP0003B See Package Number NDC0005A
Figure 3. 6-Lead WSON (LP38690SD-X.X) – Top Figure 4. 6-Lead WSON (LP38692SD-X.X), Top View
View
See Package Number NGG
See Package Number NGG0006A
PIN DESCRIPTIONS
Pin Description
This is the input supply voltage to the regulator. For WSON devices, both V
IN
pins must be tied together for
V
IN
full current operation (500mA maximum per pin).
Circuit ground for the regulator. For the PFM and SOT-223 packages this is thermally connected to the die
GND
and functions as a heat sink when the soldered down to a large copper plane.
Output sense pin allows remote sensing at the load which will eliminate the error in output voltage due to
SNS voltage drops caused by the resistance in the traces between the regulator and the load. This pin must be
tied to V
OUT
.
V
EN
The enable pin allows the part to be turned ON and OFF by pulling this pin high or low.
V
OUT
Regulated output voltage.
WSON Only - The DAP (Exposed Pad) functions as a thermal connection when soldered to a copper plane.
DAP
See WSON MOUNTING section in APPLICATION HINTS for more information.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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