Datasheet

LP3855-ADJ
www.ti.com SNVS244F –SEPTEMBER 2003–REVISED APRIL 2013
Figure 20. θ
JA
vs Copper (1 Ounce) Area for DDPAK/TO-263 Package
As shown in the figure, increasing the copper area beyond 1 square inch produces very little improvement. The
minimum value for θ
JA
for the DDPAK/TO-263 package mounted to a PCB is 32°C/W.
Figure 21 shows the maximum allowable power dissipation for DDPAK/TO-263 packages for different ambient
temperatures, assuming θ
JA
is 35°C/W and the maximum junction temperature is 125°C.
Figure 21. Maximum Power Dissipation vs Ambient Temperature for DDPAK/TO-263 Package
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