Datasheet

Exposed
DAP
OUT
GND
EN 1
2
3
4
5
IN
LP38513TJ-ADJ
ADJ
LP38513-ADJ
SNVS514C –JANUARY 2009–REVISED APRIL 2013 www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Connection Diagram
Top View
See Package Number NDQ0005A
Pin Descriptions for TO-263 THIN Package
Pin # Pin Name Function
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
1 EN
must be tied to the input voltage, or actively driven.
2 IN Input Supply Pin
3 GND Ground
4 OUT Regulated Output Voltage Pin
5 ADJ The feedback to the internal Error Amplifier to set the output voltage
The TO-263 THIN DAP connection is used as a thermal connection to remove heat from the device
to an external heat-sink in the form of the copper area on the printed circuit board. The DAP is
DAP DAP
physically connected to backside of the die, but is not internally connected to device ground. The
DAP should be soldered to the Ground Plane copper..
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Product Folder Links: LP38513-ADJ