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Power Dissipation www.ti.com
Figure 4. Enable Thresholds
7 Power Dissipation
The PSOP-8 package alone has a junction to ambient thermal resistance (θ
JA
) rating of 168°C/W when
mounted to the minimum land area (EIA/JESD51-3). When mounted on the LP38511MR-ADJ Evaluation
Board the θ
JA
rating is approximately 40°C/W.
The exposed DAP is soldered to the copper area immediately under the package. The top copper surface
area is extended to additional copper area on the bottom of the board by five thermal vias placed inside
the DAP land area.
With the 40°C/W thermal rating the LP38511MR-ADJ evaluation board will dissipate a maximum of 2.5W
with T
A
= 25°C.
Figure 5. Maximum Power Dissipation vs Ambient Temperature
4
AN-1770 LP38511MR-ADJ Evaluation Board SNVA311B–March 2009–Revised April 2013
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