Datasheet

LP38511-ADJ
SNVS545D –JANUARY 2009–REVISED APRIL 2013 www.ti.com
Electrical Characteristics (continued)
Unless otherwise specified: V
IN
= 2.50V, V
OUT
= V
ADJ
, I
OUT
= 10 mA, C
IN
= 10 µF, C
OUT
= 10 µF, V
EN
= 2.0V. Limits in standard
type are for T
J
= 25°C only; limits in boldface type apply over the junction temperature (T
J
) range of -40°C to +125°C.
Minimum and Maximum limits are ensured through test, design, or statistical correlation. Typical values represent the most
likely parametric norm at T
J
= 25°C, and are provided for reference purposes only.
Symbol Parameter Conditions Min Typ Max Units
11
I
OUT
= 10 mA - 7.5
12
Ground Pin Current, Output
mA
Enabled
11
I
GND
I
OUT
= 800 mA - 9
13
Ground Pin Current, Output 3.5
V
EN
= 0.50V - 0.1 µA
Disabled 12
I
SC
Short Circuit Current V
OUT
= 0V - 1.5 - A
Enable Input
V
EN
rising from <0.5V until V
OUT
= 0.90 1.50
V
EN(ON)
Enable ON Voltage Threshold 1.20 V
ON 0.80 1.60
V
EN
falling from 1.6V until V
OUT
= 0.60 1.40
V
EN(OFF)
Enable OFF Voltage Threshold 1.00 V
OFF 0.50 1.50
V
EN(HYS)
Enable Voltage Hysteresis V
EN(ON)
- V
EN(OFF)
- 200 - mV
V
EN
= V
IN
- 1 -
I
EN
Enable Pin Current nA
V
EN
= 0V - -1 -
Time from V
EN
< V
EN(OFF)
to V
OUT
=
t
d(OFF)
Turn-off delay - 1 -
OFF, I
LOAD
= 800 mA
µs
Time from V
EN
>V
EN(ON)
to V
OUT
=
t
d(ON)
Turn-on delay - 25 -
ON, I
LOAD
= 800 mA
AC Parameters
V
IN
= 2.5V
- 73 -
f = 120Hz
PSRR Ripple Rejection dB
V
IN
= 2.5V
- 70 -
f = 1 kHz
ρ
n(l/f)
Output Noise Density f = 120Hz - 0.4 - µV/√Hz
e
n
Output Noise Voltage BW = 10Hz - 100kHz - 25 - µV
RMS
Thermal Characteristics
T
SD
Thermal Shutdown T
J
rising - 165 -
°C
ΔT
SD
Thermal Shutdown Hysteresis T
J
falling from T
SD
- 10 -
SO PowerPad - 168 -
Thermal Resistance
θ
J-A
°C/W
Junction to Ambient
(5)
PFM - 67 -
SO PowerPad - 11 -
Thermal Resistance
θ
J-C
°C/W
Junction to Case
PFM - 2 -
(5) Device operation must be evaluated, and derated as needed, based on ambient temperature (T
A
), power dissipation (P
D
), maximum
allowable operating junction temperature (T
J(MAX)
), and package thermal resistance (θ
JA
). The typical θ
JA
ratings given are worst case
based on minimum land area on two-layer PCB (EIA/JESD51-3). See POWER DISSIPATION/HEAT-SINKING for details.
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