Datasheet

DAP
Connect to GND
IN
EN
IN
GND5
6
7
8
OUT
OUT
N/C
ADJ
1
2
3
4
Exposed
DAP
OUT
GND
EN 1
2
3
4
5
IN
LP38511TJ-ADJ
ADJ
LP38511-ADJ
SNVS545D –JANUARY 2009–REVISED APRIL 2013 www.ti.com
Connection Diagram
Figure 1. 5-Pin PFM, Top View Figure 2. 8-Pin SO PowerPad, Top View
See NDQ0005A Package See DDA0008A Package
Pin Descriptions for PFM Package
Pin # Pin Name Function
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
1 EN
must be tied to the input voltage, or actively driven.
2 IN Input Supply Pin.
3 GND Ground
4 OUT Regulated Output Voltage Pin.
5 ADJ The feedback to the internal Error Amplifier to set the output voltage.
The PFM DAP is used as a thermal connection to remove heat from the device to an external heat-
sink in the form of the copper area on the printed circuit board. The DAP is physically connected to
DAP DAP
backside of the die. The DAP is internally connected to device ground. The DAP should be soldered
to the Ground Plane copper.
Pin Descriptions for SO PowerPad Package
Pin # Pin Name Function
1, 2 OUT Regulated Output Voltage Pins. Pins 1 and 2 share current and must be connected together.
3 ADJ The feedback to the internal Error Amplifier to set the output voltage.
4 N/C No internal connection
5 GND Ground
Enable. Pull high to enable the output, low to disable the output. This pin has no internal bias and
6 EN
must be tied to the input voltage, or actively driven.
7, 8 IN Input Supply Pin. Pins 7 and 8 share current and must be connected together.
The SO PowerPad DAP is used as a thermal connection to remove heat from the device to an
external heat-sink in the form of the copper area on the printed circuit board. The DAP is physically
DAP DAP
connected to backside of the die, but is not internally connected to device ground. The DAP should
be soldered to the Ground Plane copper.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Product Folder Links: LP38511-ADJ