Datasheet

LP38501-ADJ, LP38503-ADJ
www.ti.com SNVS522H –AUGUST 2007–REVISED APRIL 2013
Pin Descriptions for TO-263 (TS) and TO-263 THIN (TJ) (continued)
Pin # Designation Function
2 IN Input Supply Pin
3 GND Ground
4 OUT Regulated Output Voltage Pin
5 ADJ Sets output voltage
The DAP is used as a thermal connection to remove heat from the device to the circuit board
copper clad area which acts as the heatsink. The DAP is electrically connected to the backside
DAP DAP
of the die. The DAP must be connected to ground potential, but can not be used as the only
ground connection.
ABSOLUTE MAXIMUM RATINGS
(1)
Storage Temperature Range −65°C to +150°C
Lead Temperature (Soldering, 5 sec.) 260°C
ESD Rating
(2)
±2 kV
Power Dissipation
(3)
Internally Limited
Input Pin Voltage (Survival) −0.3V to +6.0V
Enable Pin Voltage (Survival) −0.3V to +6.0V
Output Pin Voltage (Survival) −0.3V to +6.0V
I
OUT
(Survival) Internally Limited
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not specific performance limits. For specifications and conditions, see the
Electrical Characteristics.
(2) The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin.
(3) Operating junction temperature must be evaluated, and derated as needed, based on ambient temperature (T
A
), power dissipation (P
D
),
maximum allowable operating junction temperature (T
J(MAX)
), and package thermal resistance (θ
JA
). See Application Information.
OPERATING RATINGS
(1)
Input Supply Voltage 2.7V to 5.5V
Enable Input Voltage 0.0V to 5.5V
Output Current (DC) 0 to 3A
Junction Temperature
(2)
−40°C to +125°C
V
OUT
0.6V to 5V
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but does not specific performance limits. For specifications and conditions, see the
Electrical Characteristics.
(2) Operating junction temperature must be evaluated, and derated as needed, based on ambient temperature (T
A
), power dissipation (P
D
),
maximum allowable operating junction temperature (T
J(MAX)
), and package thermal resistance (θ
JA
). See Application Information.
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