Datasheet
LP38500-ADJ, LP38502-ADJ
www.ti.com
SNVS539F –NOVEMBER 2007–REVISED APRIL 2013
PIN DESCRIPTIONS FOR DDPAK/TO-263 and PFM PACKAGES
Pin # Designation Function
Enable (LP38502 only). Pull high to enable the output, low to disable the output. This pin has
EN
no internal bias and must be either tied to the input voltage, or actively driven.
1
In the LP38500, this pin has no internal connections. It can be left floating or used for trace
N/C
routing.
2 IN Input Supply
3 GND Ground
4 OUT Regulated Output Voltage
5 ADJ Sets output voltage
The DAP is used to remove heat from the device by conducting it to the copper clad area on
the PCB which acts as the heatsink. The DAP is electrically connected to the backside of the
DAP DAP
die. The DAP must be connected to ground potential, but can not be used as the only ground
connection.
Connection Diagrams for WSON Package
Figure 5. 8-Pin WSON, Top View (LP38500SD-ADJ, Figure 6. 8-Pin WSON, Top View (LP38502SD-ADJ,
LP38500ASD-ADJ) LP38502ASD-ADJ)
See NGS0008C Package See NGS0008C Package
PIN DESCRIPTIONS FOR WSON PACKAGE
Pin # Designation Function
1 GND Ground
Input Supply (LP38500 only). Input Supply pins share current and must be connected together
IN
on the PC Board.
2
Enable (LP38502 only). Pull high to enable the output, low to disable the output. This pin has
EN
no internal bias and must be either tied to the input voltage, or actively driven.
Input Supply. Input Supply pins share current and must be connected together on the PC
3, 4 IN
Board.
Regulated Output Voltage. Output pins share current and must be connected together on the
5, 6, 7 OUT
PC Board.
8 ADJ Sets output voltage
The DAP is used to remove heat from the device by conducting it to a copper clad area on the
PCB which acts as a heatsink. The DAP is electrically connected to the backside of the die. The
DAP DAP
DAP must be connected to ground potential, but can not be used as the only ground
connection.
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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Product Folder Links: LP38500-ADJ LP38502-ADJ