Datasheet

LP2997
www.ti.com SNVS295F –MAY 2004–REVISED APRIL 2013
PCB Layout Considerations
1. The input capacitor for the power rail should be placed as close as possible to the PVIN pin.
2. V
SENSE
should be connected to the V
TT
termination bus at the point where regulation is required. For
motherboard applications an ideal location would be at the center of the termination bus.
3. V
DDQ
can be connected remotely to the V
DDQ
rail input at either the DIMM or the Chipset. This provides the
most accurate point for creating the reference voltage.
4. For improved thermal performance excessive top side copper should be used to dissipate heat from the
package. Numerous vias from the ground connection to the internal ground plane will help. Additionally these
can be located underneath the package if manufacturing standards permit.
5. Care should be taken when routing the V
SENSE
trace to avoid noise pickup from switching I/O signals. A
0.1uF ceramic capacitor located close to the
SENSE
can also be used to filter any unwanted high frequency
signal. This can be an issue especially if long
SENSE
traces are used.
6. V
REF
should be bypassed with a 0.01 µF or 0.1 µF ceramic capacitor for improved performance. This
capacitor should be located as close as possible to the V
REF
pin.
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