Datasheet

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP2986AIMX-3.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2986AIMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2986AIMX-5.0 SOIC D 8 2500 367.0 367.0 35.0
LP2986AIMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2986ILD-3.3/NOPB WSON NGN 8 1000 213.0 191.0 55.0
LP2986ILDX-3.3/NOPB WSON NGN 8 4500 367.0 367.0 35.0
LP2986IMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2986IMM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0
LP2986IMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2986IMM-5.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2986IMMX-3.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2986IMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2986IMMX-5.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2986IMX-3.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2986IMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2986IMX-5.0 SOIC D 8 2500 367.0 367.0 35.0
LP2986IMX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 3