Datasheet

LP2960
www.ti.com SNVS112C –APRIL 1999–REVISED APRIL 2013
The table below shows measured values of θ
(J−A)
for a PC board with 1 ounce copper weight:
Package L (in.) H (in.) θ
J−A
(°C/W)
1 0.5 50
DIP
2 0.2 52
1 0.5 72
Surface Mount SOIC
2 0.2 74
As the heat must transfer from the copper to the surrounding air, best results (lowest θ
J−A
) will be obtained by
using a surface copper layer with the solder resist opened up over the heatsink area.
If an internal copper layer of a multi-layer board is used for heatsinking, the board material acts as an insulator,
inhibiting heat transfer and increasing θ
J−A
.
As with any heatsink, increasing the airflow across the board will significantly improve the heat transfer.
Typical Applications
Figure 29. Low T.C. Current Sink
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