Datasheet

. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator
LP2954, LP2954A
SNVS096D JUNE 1999REVISED MARCH 2013
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Absolute Maximum Ratings
(1)(2)
Operating Junction Temperature Range LP2954AI/LP2954I 40°C to +125°C
Storage Temperature Range 65°C to +150°C
Lead Temperature (Soldering, 5 seconds) 260°C
Power Dissipation
(3)
Internally Limited
Input Supply Voltage 20V to +30V
ESD Rating
(4)
2 kV
(1) Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifications do not apply
when operating the device outside of its rated operating conditions.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and
specifications.
(3) The maximum allowable power dissipation is a function of the maximum junction temperature, T
J
(MAX), the junction-to-ambient thermal
resistance, θ
J-A
, and the ambient temperature, T
A
. The maximum allowable power dissipation at any ambient temperature is calculated
using:
will go into thermal shutdown. The junction-to-ambient thermal resistance of the TO-220 (without heatsink) is 60°C/W, 73°C/W for the
DDPAK/TO-263, and 160°C/W for the SOIC-8. If the DDPAK/TO-263 package is used, the thermal resistance can be reduced by
increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θ
JA
is 50°C/W; with
1 square inch of copper area, θ
JA
is 37°C/W; and with 1.6 or more square inches of copper area, θ
JA
is 32°C/W. The junction-to-case
thermal resistance is 3°C/W. If an external heatsink is used, the effective junction-to-ambient thermal resistance is the sum of the
junction-to-case resistance (3°C/W), the specified thermal resistance of the heatsink selected, and the thermal resistance of the interface
between the heatsink and the LP2954. Some typical values are listed for interface materials used with TO-220:
(4) Human body model, 200pF discharged through 1.5k.
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