Datasheet
LP2952-N, LP2952A, LP2953, LP2953A
SNVS095D –MAY 2004–REVISED SEPTEMBER 2013
www.ti.com
Figure 35 shows copper patterns which may be used to dissipate heat from the LP2952 and LP2953. Table 2
shows some values of junction-to-ambient thermal resistance (θ
J–A
) for values of L and W for 1 oz. copper.
* For best results, use L = 2H
** 14-Pin PDIP is similar, refer to Table 1 for pins designated for heatsinking.
Figure 35. Copper Heatsink Patterns
Table 2. Thermal Resistance for Various Copper Heatsink Patterns
Package L (in.) H (in.) θ
J–A
(°C/W)
16-Pin PDIP 1 0.5 70
2 1 60
3 1.5 58
4 0.19 66
6 0.19 66
14-Pin PDIP 1 0.5 65
2 1 51
3 1.5 49
Surface Mount 1 0.5 83
2 1 70
3 1.5 67
6 0.19 69
4 0.19 71
2 0.19 73
Heatsink Requirements (Military Temperature Range Devices)
The maximum allowable power dissipation for the LP2953AMJ is limited by the maximum junction temperature
(+150°C) and the two parameters that determine how quickly heat flows away from the die: the ambient
temperature and the junction-to-ambient thermal resistance of the part.
The military temperature range (−55°C ≤ T
J
≤ +150°C) parts are manufactured in CDIP packages which contain
a KOVAR lead frame (unlike the industrial parts, which have a copper lead frame). The KOVAR material is
necessary to attain the hermetic seal required in military applications.
16 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LP2952-N LP2952A LP2953 LP2953A