Datasheet

*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP2950CDTX-3.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LP2950CDTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LP2950CDTX-5.0 TO-252 NDP 3 2500 367.0 367.0 35.0
LP2950CDTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LP2951ACMM VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951ACMM-3.0 VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951ACMM-3.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951ACMM-3.3 VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951ACMM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951ACMM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LP2951ACMMX-3.0 VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951ACMMX-3.0/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951ACMMX-3.3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951ACMMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
LP2951ACMX SOIC D 8 2500 367.0 367.0 35.0
LP2951ACMX-3.0/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2951ACMX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2951ACMX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LP2951ACSD WSON NGT 8 1000 210.0 185.0 35.0
LP2951ACSD/NOPB WSON NGT 8 1000 203.0 203.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 18-Jun-2014
Pack Materials-Page 3